85x45mm x 2.5mm TOUSEN TSP-168 Thermal Pad – Non-Conductive, High-Density Heat Conductor for IC Processors & Heatsinks

Key Features

• Advanced Thermal Conductivity – 2.5mm thickness and 3.2 g/cm³ density ensure rapid heat transfer for high-power components like servers, GPUs, and industrial machinery.
• Zero Electrical Conductivity – Safeguard sensitive electronics with non-conductive, corrosion-resistant material, ideal for PCBs, VGA cards, and IC processors.
• Customizable to Any Size – Easily cut the 85x45mm pad to fit laptops, game consoles, or complex heatsink layouts for seamless installation.
• Eco-Friendly & Non-Toxic – Free from harmful chemicals, ensuring safe handling in home, automotive, and industrial environments.
• Superior Elasticity & Compression – Soft, flexible design adapts to uneven surfaces while resisting wear for long-lasting thermal management.